Heatsink Small Out-Line Package (带散热片的小尺寸封装)
HSOP is a surface mount package with ìgull wingî lead form.This package has
a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance.The
exposed heat slug provides a direct path for heat conduction awayfrom an IC and into a solder
attached Printed Circuit Board (PCB).
![](http://e.hiphotos.baidu.com/zhidao/wh%3D600%2C800/sign=a2e82b1aaeaf2eddd4a441efbd202dd1/58ee3d6d55fbb2fb97f70d0e4d4a20a44723dcca.jpg)